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"Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, Flash memory, CMOS image sensors, other semiconductor components and memory modules for use in leading-edge computing, consumer, networking, and mobile products...

Micron Technology, Inc., has delivered the industry's first 4 Gigabyte (GB) Double Data Rate (DDR) synchronous DRAM (SDRAM) registered dual in-line memory module (DIMM) to Intel Corporation. The industry standard 4GB 184-pin PC1600 and PC2100 DDR SDRAM DIMM is enabled by Micron's recently announced 0.11mm 1Gb DDR266 SDRAM packaged in JEDEC-standard 400 mil TSOP packaging."

256MB Memory Stick memory

• 256mb Memory
• DDR266 PC2100 / DDR333 PC2700 / DDR400 PC3200
• SDRAM DIMM
• 32 x 64 (Single Sided or Double Sided Memory Upgrade)
• 184 Pin, Gold Contacts
• Unbuffered, Non-ECC
• 2.5 Volt
• 30 Day Money Back / Lifetime Warranty

Compatibility note: To find memory upgrade compatible with your particular system please see our Memory Configurator.

Memory types like SDRAM, DDR, and Rambus RDRAM are found in most of today's computer memory applications:

• SDRAM - Synchronous Dynamic Random Access Memory;
• RDRAM - Rambus Dynamic Random Access Memory;
• DRAM - Dynamic Random Access Memory;
• RAM - Random Access Memory;
• DDR - Double Data Rate is a type of SDRAM in which data is sent on both the rising and falling edges of clock cycles in a data burst.
• DIMM - Dual in-line Memory Module. This physical property describes a module with signal and power pins on both sides of the board. DIMMs can be any number of pins including 144pin SODIMM SDRAM, 168pin SDRAM memory, and 184pin DDR SDRAM.
• Unbuffered - This is the most common configuration for memory. These modules do not use any supporting TTL logic.
• ECC - Error Correcting Code. Logic designed to detect and correct memory errors. Memory modules designed with 72 bits of memory support the motherboard's ECC function.
• Registered - Registers delay memory information for one clock cycle to ensure all communication from the chipset is collected by the clock edge, providing a controlled delay on heavily loaded memories. This allows you to installed four or more modules or larger memory sizes in your application. Registered and non-registered memory can not be mixed.